Title: Thermal Engineering Intern

Industry: Space Technology

Location: Ahmedabad

Role Type: Full-time, on-site internship

About the Role:

We are seeking a talented and motivated Spacecraft Thermal Engineering Intern to join our team. As an intern, you will gain hands-on experience in Spacecraft thermal design, analysis & thermal management while working on real-world projects that contribute to the development of innovative space systems.

Key Responsibilities:

- Electronics Package level Thermal Analysis:

• Develop FE models & thermal models for electronic packages.
• Perform detailed thermal analysis of PCB & Carrier plate base avionics subsystems.
• Optimize thermal design of electronic packages to ensure reliable operation in space environments.
• Analyze thermal test data to verify design performance and identify potential issues.
• Thermal analysis reports generation.

- Satellite level Orbital - thermal analysis:

• Develop FE models & thermal models for satellite.
• Conduct orbital thermal analyses of entire satellite & its systems.
• Optimize spacecraft thermal design to meet mission requirements.

- Thermal Design & thermal management:

• Contribute to the design and optimization of thermal control systems, including thermal coatings, radiators, heaters, and insulation.
• Participate in design reviews and provide technical input to ensure thermal design compliance.
• Contribute to the development of innovative thermal solutions for future missions.

- Thermal testing & implementation of thermal elements:

• Support the planning and execution of thermal vacuum tests.
• Analyze test data to validate thermal models and identify potential design improvements.
• Implementation of Thermal Elements (e.g., Heaters, Sensors, Thermal tapes, MLI etc.) for satellite.

Qualifications:

• Having a bachelor's or master's degree in mechanical engineering, or preferably in Thermal Engineering.
• Strong understanding of heat transfer principles, including conduction, convection, and radiation.
• Proficiency in space system thermal analysis software (e.g., Siemens NX).
• Proficiency in CAD software (e.g., Siemens NX, SolidWorks, Inventor).
• Experience with PCB modelling software (e.g., NX PCB Exchange) is a plus.
• Excellent analytical and problem-solving skills.
• Strong attention to detail and accuracy.
• Ability to work independently and as part of a team.