Role: Embedded Hardware Lead – Satellite Payload Electronics

Industry: Space Technology

Location: Ahmedabad, Gujarat, India

Role Type: Full-time

Experience Requirement: 5-10 years

About the Role:
We are seeking an experienced Lead - Embedded Hardware to lead the design, development, integration, and qualification of complex electronic hardware for Earth observation satellite payloads and other space applications.

The role requires strong technical expertise in highspeed digital, mixed signal, FPGA, microprocessor , and microcontroller-based hardware platforms. The selected candidate will provide technical leadership to a team of approximately Embedded Hardware Engineers and PCB Layout Designers, while working closely with FPGA, embedded software, RF, mechanical, systems, manufacturing, and test teams.

Key Responsibilities:

• Lead the architecture, design, development, integration, and validation of embedded hardware for satellite payload and high reliability applications.
• Manage, mentor, and technically guide a team of Embedded Hardware Engineers and PCB Layout Designers.
• Own hardware development activities from system requirements and architecture through schematic design, PCB development, bring up, qualification, and production release.
• Design and review hardware platforms based on microcontrollers, microprocessors, FPGAs, high-speed ADCs/DACs, memory devices, RF circuits, and power management components.
• Define and approve PCB stack ups, placement and routing constraints, controlled-impedance requirements, length matching, return paths, grounding, shielding, and analog/digital/RF isolation.
• Conduct schematic and PCB layout reviews for complex multilayer mixed-signal boards.
• Guide signal integrity, power integrity, thermal, EMI/EMC, timing, channel-loss, crosstalk, eye diagram, and power distribution network analyses.
• Lead component selection considering availability, lifecycle, derating, radiation tolerance, environmental capability, and long-term reliability.
• Establish component reliability and qualification requirements, including screening, derating, worst-case circuit analysis, FMEA, and failure investigations.
• Support hardware qualification and environmental testing, including vibration, thermal-vacuum, thermal cycling, EMI/EMC, and functional performance testing.
• Lead board bringup, debugging, root cause analysis, design optimization, and corrective action activities.
• Collaborate with cross-functional teams to resolve system-level electrical, mechanical, thermal, firmware, FPGA, and manufacturing issues.
• Prepare and review design specifications, interface control documents, design analysis reports, test plans, qualification procedures, and technical review documentation.
• Support project planning, task allocation, technical risk management, design reviews, and hardware development schedules.

Minimum Requirements:

• Bachelor’s or Master’s degree in Electronics, Electrical Engineering, Embedded Systems, or a related discipline.
• 5+ years of professional experience in embedded hardware, high speed digital, or complex electronic-board design.
• Demonstrated experience leading or managing a hardware team of approximately 3–4 engineers and layout designers.
• Strong experience with microcontroller, microprocessor, and FPGA based hardware platforms.
• Proven experience designing and reviewing complex multilayer mixed signal PCBs.
• Strong knowledge of high speed interfaces, signal integrity, power integrity, clocking, power sequencing, and EMI/EMC design.
• Experience defining and reviewing PCB layout constraints for high-speed digital, analog, RF, memory, clock, and power circuits.
• Hands on experience with hardware bring up, debugging, laboratory testing, and root cause analysis.
• Experience working with cross functional engineering teams throughout the complete hardware development lifecycle.
• Understanding of component derating, reliability analysis, thermal design, qualification testing, and manufacturing considerations.

Preferred Qualifications:

• Experience developing electronics for satellites, spacecraft payloads, aerospace, defence, or other high reliability applications.
• Knowledge of space grade, radiation tolerant, and high-reliability electronic components.
• Experience with vibration, thermal-vacuum, thermal cycling, EMI/EMC, and environmental qualification testing.
• Familiarity with radiation effects, component screening, FMEA, worst-case circuit analysis, and applicable space or military standards.
• Experience with RF integration, high-speed data converters, JESD204B/C, PCIe, high-speed SERDES, and SI/PI simulation tools.